RoHS



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From: Marcin E. Hamerla <Xmeh4njusy_at_nospam_Xpoczta.Xonet.Xpl.removeX>
Subject: RoHS
Date: Sun, 06 Mar 2005 16:19:43 +0100


Witam,

Cytuje ciekawy artykul z listy PCADa a dotyczacy RoHSa:

Lead free components are more of a risk than the PCB.

Tin whisker growth has been documented in areas without solder. Most
of
them are on the order of 100u inch.

Here is a lot of information, and lots of pretty pictures.
http://nepp.nasa.gov/whisker/

Most of the tin whiskers are being found on component leads and form
at the
bend points.

IBM and Sony are petitioning to exempt all ICs with lead spacing less
than
25 mils from RoHS.

Since most lead free components are some form of white tin, the
engineers
need to worry about the parts more than the PCB plating. Some
manufacturers
are already 100% lead free, so you may be at risk now.

--
Pozdrowienia, Marcin E. Hamerla

"Jak ja was, kurrwy, nienawidzę, jak do was bym z kałacha bił."